Microwave sintering Ag nanoparticle interconnects infiltrated by silver acetate ammonia mixed solution

Metal interconnects often require subsequent processing to functionalize metal microstructures in jet printer, 3D printer, and nanoimprint process with nanoparticles. In this paper, the silver acetate ammonia mixed solution was used to infiltrate pseudoplastic metal nanoparticle fluids, and silver acetate was decomposed quickly by microwave to make the interconnect wires. The experimental results show that after 30 min of microwave sintering, the resistivity of the interconnect wires infiltrated by the silver acetate ammonia mixed solution is reduced by 62.9% compared to the interconnect wires only subjected to microwave heat treatment. It takes 75 min to achieve the same resistivity by only microwave sintering.