Characterization of Generation Lifetime and Surface Generation Velocity of Semiconductor Wafers by a Contactless Zerbst Method

A contactless Zerbst method has been developed to characterize the generation lifetime and the surface generation velocity of a semiconductor wafer. This characterization is unaffected by the gate leakage current or the device fabrication process. In this study, this contactless Zerbst method was used to characterize the generation lifetime and the surface generation velocity of a partially Au-doped Si wafer. The results demonstrate that the contactless Zerbst method is a powerful technique for characterizing the generation lifetimes and the surface recombination velocities of semiconductor wafers.