Investigation of moisture uptake into printed circuit board laminate and solder mask materials

被引：0
作者：
Hélène Conseil-Gudla
Visweswara C. Gudla
Shruti Borgaonkar
Morten S. Jellesen
Rajan Ambat
机构：
[1] Technical University of Denmark,Materials and Surface Engineering, Department of Mechanical Engineering
来源：
Journal of Materials Science: Materials in Electronics | 2017年 / 28卷
关键词：
PCBs; Print Circuit Board; Moisture Absorption; Dielectric Loss Tangent; Saturated Water Vapour;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with the moisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and on increase of water uptake of the materials has been analysed.
引用
收藏
页码：6138 / 6151
页数：13
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