Effect of Particle Shapes on Thermal Shock Reliability of Sintered Ag Joints under Low-Temperature Pressureless Sintering

被引:0
作者
Liujue Wang
Yong Ji
Shouwei Li
Peng Mei
机构
[1] China Key System and Integrated Circuit Co.,
[2] Ltd.,undefined
[3] Wuxi Zhong Wei High-Tech Electronics Co.,undefined
[4] Ltd.,undefined
来源
Journal of Materials Engineering and Performance | 2023年 / 32卷
关键词
Ag sinter joint; flake particle; reliability; spherical particle; thermal shock;
D O I
暂无
中图分类号
学科分类号
摘要
The long-term reliability of the die-attach module under low-temperature pressureless sintering with two different shapes of Ag particle, flake particles paste, and spherical particles paste was investigated by means of thermal shock tests. The utilized particle shape determines the microstructure of sintered Ag, which leads to an important effect on sintered Ag joints’ microstructural evolution and mechanical properties after the thermal reliability test. The Ag flake particles provide thinner necking, resulting in the delamination at the interface after 1000 thermal shock cycles, while the microstructure has no obvious change for spherical particles. The difference in mechanical properties is discussed based on the shear strength results, which revealed that the die-attach module sintered with spherical particles paste has a much greater bonding strength above 20 MPa than that of sintering with flake particles paste after thermal shock tests. For further study, the fracture surface of bonding joints sintered with different shapes of Ag particles was also observed. The SEM observation revealed that many sharp protrusions indicated ductile deformation was observed in the sintered Ag spherical structure, while the sharp protrusions translated smooth flat area represented brittle fracture after thermal shock 1000 cycles.
引用
收藏
页码:4427 / 4436
页数:9
相关论文
共 72 条
[11]  
Basaran C(2021)Pressureless and Low-Temperature Sinter-Joining on Bare Si, SiC and GaN by a Ag Flake Paste Scripta Mater. 198 113833-961
[12]  
Hopkins D(2019)Ag Particles for Sinter Bonding: Flakes or Spheres? Appl. Phys. Lett. 114 253103-4838
[13]  
McCormack M(2019)Necking Growth and Mechanical Properties of Sintered Ag Particles with Different Shapes Under Air and N 2 Atmosphere J. Mater. Sci. 54 13344-51
[14]  
Jin S(2010)Low Temperature Sintering of Ag Nanoparticles for Flexible Electronics Packaging Appl. Phys. Lett. 97 153117-1340
[15]  
Kammlott GW(2007)Novel Method for Room Temperature Sintering of Ag Nanoparticle Paste in Air Chem. Phys. Lett. 441 305-1264
[16]  
Yoon JW(2014)Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? J. Electron. Mater. 43 947-63
[17]  
Chun HS(2016)Identifying the Development state of Sintered silver (Ag) as a Bonding Material in the Microelectronic Packaging via a Patent Landscape Study J. Elect. Packaging 138 100528-442
[18]  
Koo JM(2014)Effect of Surface Carbon Coating on Sintering of Silver Nanoparticles: in situ TEM Observations Chem. Commun. 50 4835-1001
[19]  
Ellis B(2017)Macroscale and Microscale Fracture Toughness of Microporous Sintered Ag for Applications in Power Electronic Devices Acta Mater. 129 41-3075
[20]  
Li Y(2013)Microstructural Stability of Ag Sinter Joining in Thermal Cycling J. Mater. Sci.: Mater. Electron. 24 1332-1410