Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood

The interference of copper based preservative treated southern yellow pine (SYP) on the cure of phenol-formaldehyde adhesives was investigated by using differential scanning calorimetry (DSC). Copper preservatives used in this study include copper azole (NS), alkali copper quat (ACQ)-type C (NW). Three commercial phenol-formaldehyde (PF) adhesives used for oriented strand board (OSB) face area, core area and a plywood adhesive were studied. The curing peak temperature and peak time of OSB core and face PF resin shifted to higher temperature and duration in the presence of CCA, NS, and NW-treated SYP compared to that in untreated SYP. The above treatments interfere with the cure of OSB core and face PF resin. Untreated SYP showed a curing accelerating effect on the cure of plywood adhesive, but the accelerating effect of copper-treated SYP on the cure of plywood resin was not significant.