Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood

被引：0

作者：

Haihong Jiang

D. Pascal Kamdem

机构：

[1] Pella Corporation,Department of Forestry

[2] MSU,undefined

来源：

Wood Science and Technology | 2007年 / 41卷

关键词：

Differential Scanning Calorimetry Thermogram; Oriented Strand Board; Phenol Formaldehyde; Adhesive Resin; Phenol Formaldehyde Resin;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The interference of copper based preservative treated southern yellow pine (SYP) on the cure of phenol-formaldehyde adhesives was investigated by using differential scanning calorimetry (DSC). Copper preservatives used in this study include copper azole (NS), alkali copper quat (ACQ)-type C (NW). Three commercial phenol-formaldehyde (PF) adhesives used for oriented strand board (OSB) face area, core area and a plywood adhesive were studied. The curing peak temperature and peak time of OSB core and face PF resin shifted to higher temperature and duration in the presence of CCA, NS, and NW-treated SYP compared to that in untreated SYP. The above treatments interfere with the cure of OSB core and face PF resin. Untreated SYP showed a curing accelerating effect on the cure of plywood adhesive, but the accelerating effect of copper-treated SYP on the cure of plywood resin was not significant.

引用

页码：637 / 644

页数：7

共 20 条

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