Mathematical modeling of electrodeposition of permalloy thin film II. pulsed current plating

被引：0
作者：
S.-K Doo
H.-J Sohn
T. Kang
机构：
[1] Samsung Advanced Institute of Technology,Electrochemistry Laboratory
[2] Seoul National University,School of Materials Science and Engineering
来源：
Metals and Materials | 1999年 / 5卷
关键词：
Modeling; Electrodeposition; Permalloy; pulsed current;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A mathematical model presented for direct current plating is extended to describe the electrodeposition of permalloy under pulsed current plating conditions. The agreement between the calculated and experimental values is excellent. The content of iron in permalloy thin film under the pulsed current condition is higher than under direct current plating at the same average current density, which is explained in terms of various plating parameters from simulated results.
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页码：459 / 463
页数：4
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