Thermal study of an epoxy system DGEBA (n=0)/mXDA modified with POSS

被引:0
|
作者
M. Villanueva
J. L. Martín-Iglesias
J. A. Rodríguez-Añón
J. Proupín-Castiñeiras
机构
[1] Universidade de Santiago de Compostela Campus Sur,Research Group TERBIPROMAT, Departamento de Física Aplicada
来源
Journal of Thermal Analysis and Calorimetry | 2009年 / 96卷
关键词
activation energy; DSC; epoxy resin; glass transition temperature; polyhedral oligomeric silsesquioxanes nanoparticles; TG;
D O I
暂无
中图分类号
学科分类号
摘要
The thermal degradation of the epoxy system diglycidyl ether of bisphenol A (DGEBA n=0) and m-xylylenediamine (mXDA) containing different concentrations of polyhedral oligomeric silsesquioxanes (POSS) nanoparticles was studied by thermogravimetric analysis in order to determine the influence of both, the POSS concentration and the curing cycle on the degradation process and to compare it with the results for the non modified system.
引用
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页码:575 / 582
页数:7
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