Role of trace elements on tensile behavior of accumulative roll-bonded pure copper

被引:0
作者
Younghwan Jang
Sangshik Kim
Seungzeon Han
Chayong Lim
Changjoo Kim
Masahiro Goto
机构
[1] Gyeongsang National University,Division of Materials Science and Engineering, Engineering Research Institute
[2] Korea Institute of Machinery and Materials,Materials Technology Department
[3] Oita University,Department of Mechanical Engineering
来源
Journal of Materials Science | 2005年 / 40卷
关键词
Polymer; Copper; Pure Copper; Tensile Behavior;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:3527 / 3529
页数:2
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