Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

被引：0
作者：
Q. K. Zhang
C. W. An
Z. L. Song
机构：
[1] Ningbo Institute of Materials Technology and Engineering,Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies
[2] Chinese Academy of Sciences,undefined
来源：
Journal of Electronic Materials | 2024年 / 53卷
关键词：
Solder joints; thermal cycling; current; electromigration; coupling damage; plastic deformation;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：2544 / 2553
页数：9
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