Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

被引：0
作者：
Q. K. Zhang
C. W. An
Z. L. Song
机构：
[1] Ningbo Institute of Materials Technology and Engineering,Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies
[2] Chinese Academy of Sciences,undefined
来源：
Journal of Electronic Materials | 2024年 / 53卷
关键词：
Solder joints; thermal cycling; current; electromigration; coupling damage; plastic deformation;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：2544 / 2553
页数：9
相关论文
共 114 条
  • [21] Agostini B(2022)Sn Microelectron. Reliab. 132 10002-undefined
  • [22] Fabbri M(2011)-reinforced composite solder joints during electromigration Mater. Sci. Eng. A 528 114086-undefined
  • [23] Park JE(2022)Anisotropic crystal plasticity finite element modeling of the effect of crystal orientation and solder joint geometry on deformation after temperature change J. Mater. Sci. Mater. Electron. 33 163987-undefined
  • [24] Wojtan L(2021)Thermal fatigue behavior of Sn-rich (Pb-free) solders Microelectron. Reliab. 119 130-undefined
  • [25] Thome JR(2022)Thermal fatigue reliability improvement of leadless ceramic chip carrier solder joints J. Alloys Compd. 903 undefined-undefined
  • [26] Michel B(2019)High-temperature shear strength of lead-free Sn-Sb-Ag/Al J. Non-Newton. Fluid. 263 undefined-undefined
  • [27] Lang FQ(2023)O Eng. Fract. Mech. 292 undefined-undefined
  • [28] Yamaguchi H(undefined) composite solder undefined undefined undefined-undefined
  • [29] Ohashi H(undefined)Effects of shear test temperatures and conditions on mechanical properties of Sn-Ag flip-chip solder bumps undefined undefined undefined-undefined
  • [30] Sato H(undefined)A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions undefined undefined undefined-undefined
12345678910