Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

[11] Bhavnani SH(2013)Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude Mater. Sci. Eng. A 2013 574-undefined

[12] Venkatasubramanian R(2017)Early stages of localized recrystallization in Pb-free BGA solder joints subjected to thermomechanical stress J. Alloys Compd. 704 6017-undefined

[13] Mahajan R(2011)In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints Acta Mater. 59 2526-undefined

[14] Joshi Y(2018)A mechanistic thermal fatigue model for SnAgCu solder joints J. Electron. Mater. 47 43-undefined

[15] Sammakia B(2014)The influence of Sn orientation on intermetallic compound evolution in idealized Sn-Ag-Cu 305 interconnects: an electron backscatter diffraction study of electromigration J. Electron. Mater. 43 98-undefined

[16] Myers BA(2015)Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration Acta Mater. 100 3807-undefined

[17] Chorosinski L(2023)High temperature thermal-electrical coupling damage mechanisms of SnAgCu/Cu solder joints J. Electron. Mater. 52 1705-undefined

[18] Baelmans M(2018)Effects of grain orientation on Cu J. Electron. Mater. 47 231-undefined

[19] Sathyamurthy P(2009)Sn J. Electron. Mater. 38 799-undefined

[20] Raad PE(2008) growth behavior in Cu Metall. Mater. Trans. A 39A 3967-undefined

[11] Bhavnani SH(2013)Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude Mater. Sci. Eng. A 2013 574-undefined

[12] Venkatasubramanian R(2017)Early stages of localized recrystallization in Pb-free BGA solder joints subjected to thermomechanical stress J. Alloys Compd. 704 6017-undefined

[13] Mahajan R(2011)In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints Acta Mater. 59 2526-undefined

[14] Joshi Y(2018)A mechanistic thermal fatigue model for SnAgCu solder joints J. Electron. Mater. 47 43-undefined

[15] Sammakia B(2014)The influence of Sn orientation on intermetallic compound evolution in idealized Sn-Ag-Cu 305 interconnects: an electron backscatter diffraction study of electromigration J. Electron. Mater. 43 98-undefined

[16] Myers BA(2015)Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration Acta Mater. 100 3807-undefined

[17] Chorosinski L(2023)High temperature thermal-electrical coupling damage mechanisms of SnAgCu/Cu solder joints J. Electron. Mater. 52 1705-undefined

[18] Baelmans M(2018)Effects of grain orientation on Cu J. Electron. Mater. 47 231-undefined

[19] Sathyamurthy P(2009)Sn J. Electron. Mater. 38 799-undefined

[20] Raad PE(2008) growth behavior in Cu Metall. Mater. Trans. A 39A 3967-undefined