Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

[1] Li Y(2006)Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications Mater. Sci. Eng. R 51 1-undefined

[2] Wong CP(2000)Lead-free solders in microelectronics Mater. Sci. Eng. R 27 95-undefined

[3] Abtew M(2008)Thermal challenges in next-generation electronic systems IEEE. Trans. Compon. Pack. Technol. 31 801-undefined

[4] Selvaduray G(2007)State of the art of high heat flux cooling technologies Heat Transf. Eng. 28 258-undefined

[5] Garimella SV(2011)Improvement in joint reliability of SiC power devices by a diffusion barrier between Au-Ge solder and Cu/Ni(P)-metalized ceramic substrates J. Electron. Mater. 40 1563-undefined

[6] Fleischer AS(2022)Thermomechanical fatigue damage model of a solder joint in electronic devices: an interval arithmetic based approach J. Electron. Mater. 51 5376-undefined

[7] Murthy JY(2005)Three-dimensional simulation on current-density distribution in flip-chip solder joints under electric current stressing J. Appl. Phys. 98 90-undefined

[8] Keshavarzi A(2012)A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products Microelectron. Reliab. 52 469-undefined

[9] Prasher R(2008)Analysis of solder joint failure criteria and measurement techniques in the qualification of electronic products IEEE. Trans. Compon. Pack. Technol. 31 3495-undefined

[10] Patel C(2022)Estimation of thermomechanical fatigue lifetime of ball grid solder joints in electronic devices using a machine learning approach J. Electron. Mater. 51 374-undefined

[1] Li Y(2006)Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications Mater. Sci. Eng. R 51 1-undefined

[2] Wong CP(2000)Lead-free solders in microelectronics Mater. Sci. Eng. R 27 95-undefined

[3] Abtew M(2008)Thermal challenges in next-generation electronic systems IEEE. Trans. Compon. Pack. Technol. 31 801-undefined

[4] Selvaduray G(2007)State of the art of high heat flux cooling technologies Heat Transf. Eng. 28 258-undefined

[5] Garimella SV(2011)Improvement in joint reliability of SiC power devices by a diffusion barrier between Au-Ge solder and Cu/Ni(P)-metalized ceramic substrates J. Electron. Mater. 40 1563-undefined

[6] Fleischer AS(2022)Thermomechanical fatigue damage model of a solder joint in electronic devices: an interval arithmetic based approach J. Electron. Mater. 51 5376-undefined

[7] Murthy JY(2005)Three-dimensional simulation on current-density distribution in flip-chip solder joints under electric current stressing J. Appl. Phys. 98 90-undefined

[8] Keshavarzi A(2012)A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products Microelectron. Reliab. 52 469-undefined

[9] Prasher R(2008)Analysis of solder joint failure criteria and measurement techniques in the qualification of electronic products IEEE. Trans. Compon. Pack. Technol. 31 3495-undefined

[10] Patel C(2022)Estimation of thermomechanical fatigue lifetime of ball grid solder joints in electronic devices using a machine learning approach J. Electron. Mater. 51 374-undefined