Special issue on design, test, integration and packaging of EMS/MOEMS, 2013

被引：0

作者：

Bernard Courtois

Bernd Michel

机构：

[1] CMP,

[2] Micro Materials Center,undefined

[3] Microsystem Technologies,undefined

来源：

Microsystem Technologies | 2015年 / 21卷

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：1811 / 1811

共 50 条

[1] Special issue on design, test, integration and packaging of EMS/MOEMS, 2013
Courtois, Bernard
Michel, Bernd
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2015, 21 (09): : 1811 - 1811
[2] Special issue on design, test, integration and packaging of MEMS/MOEMS, 2012
Microsystem Technologies, 2013, 19 : 773 - 773
[3] Special issue on design, test, integration and packaging of MEMS/MOEMS, 2011
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Michel, Bernd
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[4] Special issue on design, test, integration and packaging of MEMS/MOEMS, 2012
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[6] Special issue on design, test, integration and packaging of MEMS/MOEMS, 2011
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[8] Special section on Design, Test, Integration and Packaging of MEMS/MOEMS, 2013
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[9] Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016
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[10] Editorial to special issue on design, test, integration and packaging of MEMS/MOEMS, 2007
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