Reduction of multilayer ceramic capacitor vibration by changing the cover thickness

被引:0
作者
Byung-Han Ko
Heung-Gil Park
Dongjoon Kim
No-Cheol Park
Young-Pil Park
机构
[1] Yonsei University,Department of Mechanical Engineering
[2] Samsung Electro-Mechanics Co.,LCR Division
[3] Ltd.,Center for Information Storage Device
[4] Yonsei University,undefined
来源
Microsystem Technologies | 2016年 / 22卷
关键词
Dielectric Layer; Print Circuit Board; Cover Layer; Active Section; Acoustic Noise;
D O I
暂无
中图分类号
学科分类号
摘要
Vibration of multilayer ceramic capacitors (MLCCs), caused by the piezoelectricity of the dielectric material, BaTiO3, can generate acoustic noise in electronic devices. To reduce the vibration of MLCCs, the relationship between the cover layer thickness and vibration of the MLCC was analyzed in this study. A numerical model using a finite element method was constructed for a parameter study of the cover layer. The results indicated that increasing the cover layer thickness reduced the vibration. Especially, thicker head and side covers largely reduced vibrations at the head and side surfaces of the MLCC. Increasing the thickness of the top cover reduced the entire vibration of the MLCC, while thickening the head and side covers increased top surface vibration.
引用
收藏
页码:1375 / 1380
页数:5
相关论文
共 27 条
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