Electroceramic Thick Film Fabrication for MEMS

The production of thick film elecroceramic films (10–100 μm thick) for micro-electromechanical system (MEMS) applications is of great interest due to the drive for miniaturisation, high power/sensitivity and system integration. This article gives a review of a range of techniques for the deposition and patterning of oxide ceramic thick films for use in MEMS and microsystems. Issues associated with sintering of films on a constraining substrate (including the use of sintering aids) are examined with a view to maximising the densification of the films. For completeness, brief descriptions of the thick film patterning techniques and typical dielectric and piezoelectric properties are given.