共 189 条
[1]
Jiang H(2013)Recent advances of nanolead-free solder material for low processing temperature interconnect applications Microelectron. Reliab. 53 1968-undefined
[2]
Moon K-S(2010)Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy Mater. Charact. 61 474-undefined
[3]
Wong CP(2005)Synthesis and characterization of lead-free solders with Sn-3.5Ag-xCu (x=0.2, 0.5, 1.0) alloy nanoparticles by the chemical reduction method J. Electrochem. Soc. 152 J105-undefined
[4]
Zou C(2012)Size control and characterization of Sn-Ag-Cu lead-free nanosolders by a chemical reduction process J. Electron. Mater. 41 313-undefined
[5]
Gao Y(2012)Nanoparticles of Sn30Ag05Cu alloy synthesized at room temperature with large melting temperature depression J. Mater. Sci. 23 2-undefined
[6]
Yang B(2009)Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy J. Alloys Compd. 484 777-undefined
[7]
Zhai Q(2012)Calculating the diffusivity of Cu and Sn in Cu3Sn intermetallic by molecular dynamics simulations Mater. Lett. 73 92-undefined
[8]
Hsiao L-Y(1994)Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: experimental analysis J. Electron. Mater. 23 721-undefined
[9]
Duh J-G(2008)Electromigration reliability and morphologies of Cu pillar flip-chip solder joints with Cu substrate pad metallization J. Electron. Mater. 37 1624-undefined
[10]
Yung KC(2015)Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system Calphad 49 101-undefined