A study of the influence of a new promoter on the adhesion of rubber to a metal cord

被引：0

作者：

Kasperovich A.V. ^{[1
]}

Krotova O.A. ^{[1
]}

Potapov E.E. ^{[2
]}

Reznichenko S.V. ^{[2
]}

Shkodich V.F. ^{[3
]}

机构：

[1] Belarus State Technological University, Sverdlova ul. 13a, Minsk

[2] Moscow State University of Fine Chemical Technologies, Vernadskogo pr. 86, Moscow

[3] Kazan National Research Technological University, Karla Marksa ul. 68, Kazan

来源：

Kasperovich, A.V. (andkasp@mail.ru) | 1600年 / Maik Nauka Publishing / Springer SBM卷 / 09期

关键词：

adhesion; cobalt compounds; metal cord; polyisoprene rubber; precipitated silica; rubber;

D O I：

10.1134/S1995421215040061

中图分类号：

学科分类号：

摘要：

A promoter of adhesion of a rubber to a metal cord based on precipitated silica modified by cobalt was developed. The analysis of its qualitative and quantitative composition was carried out. The effect of the obtained compounds on the technological and physico-mechanical properties of filled elastomeric compositions based on synthetic polyisoprene rubber and on the properties of metal cord–rubber systems was studied. It was shown that application of modified precipitated silica allows both making elastomeric compositions cheaper and improving their adhesive properties. © 2016, Pleiades Publishing, Ltd.

引用

页码：68 / 71

页数：3

共 8 条

[1] Kauch. Rezina, 2, pp. 25-28, (2004)
[2] Bobrov Y.A., Kandyrin K.D., Shmurak I.L., Potapov E.E., Kauch. Rezina, 2, pp. 37-45, (2005)
[3] Dik D.S., Rubber Technology: Compounding and Testing, (2010)
[4] Portnoi T.B., Lonshchakova T.I., Mokhnatkina E.G., Et al., Kauch. Rezina, 2, pp. 28-29, (2004)
[5] Kostrykina G.I., Sudzilovskaya T.N., Kokoreva M.A., Borodin I.A., Izv. Vyssh. Uchebn. Zaved., Khim. Khim. Tekhnol., 54, 10, pp. 138-140, (2011)
[6] Meledina L.A., Sakharova E.V., Kandyrin K.L., Gordon E.P., Kauch. Rezina, 5, pp. 18-21, (2006)
[7] Burmistr M.V., Shilov V.V., Ovcharov V.I., Proceedings 10th Anniversary Russian Scientific and Practical Conference Rubber Industry. Raw Stock, Materials, and Technology, (2003)
[8] JP Appl, (2003)

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