Evaluation of ion/electron beam induced deposition for electrical connection using a modern focused ion beam system

被引：7

作者：

An B.-S. ^{[1
]}

Kwon Y. ^{[1
]}

Oh J.-S. ^{[1
]}

Shin Y.-J. ^{[2
]}

Ju J.-S. ^{[2
]}

Yang C.-W. ^{[1
]}

机构：

[1] School of Advanced Material Science and Engineering, Sungkyunkwan University, Suwon

[2] Cooperative Center for Research Facilities, Sungkyunkwan University, Suwon

来源：

Applied Microscopy | 2019年 / 49卷 / 01期

关键词：

Electrical resistance; Electron beam induced deposition; Focused ion beam; Ion beam induced deposition;

D O I：

10.1186/s42649-019-0008-2

中图分类号：

学科分类号：

摘要：

Focused ion beam method, which has excellent capabilities such as local deposition and selective etching, is widely used for micro-electromechanical system (MEMS)-based in situ transmission electron microscopy (TEM) sample fabrication. Among the MEMS chips in which one can apply various external stimuli, the electrical MEMS chips require connection between the TEM sample and the electrodes in MEMS chip, and a connected deposition material with low electrical resistance is required to apply the electrical signal. Therefore, in this study, we introduce an optimized condition by comparing the electrical resistance for C-, Pt-, and W- ion beam induced deposition (IBID) at 30 kV and electron beam induced deposition (EBID) at 1 and 5 kV. The W-IBID at 30 kV with the lowest electrical resistance of about 30 Ω shows better electrical properties than C- and Pt-IBID electrodes. The W-EBID at 1 kV has lower electrical resistance than that at 5 kV; thus, confirming its potential as an electrode. Therefore, for the materials that are susceptible to ion beam damage, it is recommended to fabricate electrical connections using W-EBID at 1 kV. © 2019, The Author(s).

引用

共 7 条

[1]

An B.S., Shin Y.J., Ju J.S., Yang C.W., Transmission Electron Microscopy Specimen Preparation for Two Dimensional Material Using Electron Beam Induced Deposition of a Protective Layer in the Focused Ion Beam Method, Applied Microscopy, 48, (2018)

[2]

Giannuzzi L.A., Stevie F.A., A review of focused ion beam milling techniques for TEM specimen preparation, Micron, 30, (1999)

[3]

Hammad Fawey M., Chakravadhanula V.S., Reddy M.A., Rongeat C., Scherer T., Hahn H., Fichtner M., Kubel C., In-Situ TEM Studies of Micron-sized All-solid-state Fluoride Ion Batteries: Preparation, Prospects, and Challenges, Microsc, . Res. Tech, 79, (2016)

[4]

Kato N.I., Reducing focused ion beam damage to transmission electron microscopy samples, J. Electron Microsc., 53, (2004)

[5]

Mele L., Konings S., Dona P., Evertz F., Mitterbauer C., Faber P., Schampers R., Jinschek J.R., A MEMS-Based Heating Holder for the Direct Imaging of Simultaneous In-Situ Heating and Biasing Experiments in Scanning/Transmission Electron Microscopes, Microsc. Res. Tech., 79, (2016)

[6]

Vijayan S., Jinschek J.R., Kujawa S., Greiser J., Aindow M., Focused Ion Beam Preparation of Specimens for Micro-Electro-Mechanical System-based Transmission Electron Microscopy Heating Experiments, Microsc. Microanal., 23, (2017)

[7]

Wilhite P., Uh H.S., Kanzaki N., Wang P., Vyas A., Maeda S., Yamada T., Yang C.Y., Electron-beam and ion-beam-induced deposited tungsten contacts for carbon nanofiber interconnects, Nanotechnology, (2014)

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