A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles

被引：0
|
作者：
Y. Morisada
T. Nagaoka
M. Fukusumi
Y. Kashiwagi
M. Yamamoto
M. Nakamoto
H. Kakiuchi
Y. Yoshida
机构：
[1] Osaka Municipal Technical Research Institute,
[2] Daiken Chemical Co.,undefined
[3] Lid,undefined
来源：
Journal of Electronic Materials | 2011年 / 40卷
关键词：
Ag nanoparticles; mixed nanoparticles; bonding process; pressureless bonding; low-temperature bonding; bonding strength;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A low-temperature pressureless bonding process using a mixture of trimodal-sized Ag nanoparticles was proposed to form excellent Cu-to-Cu joints. Cu-to-Cu joints formed using the mixed Ag nanoparticles at 350°C for 5 min showed bonding strength of 13.7 MPa, in spite of the bonding process without pressure. Elongated dimples observed on the fracture surface of the Cu-to-Cu joint strongly support the effect of the trimodal mixture system of Ag nanoparticles in the low-temperature pressureless bonding process.
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页码：2398 / 2402
页数：4
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