MEMS based vacuum packaging method of optically readable infrared focal plane array

A MEMS based vacuum packaging method is developed for uncooled optically readable infrared focal plane array (OR-IRFPA). The vacuum packaging structure is made up of three layers: a glass visible window, a silicon spacer, and a silicon infrared window. The silicon spacer is bonded with the glass visible window to form two cavities: one cavity for getter and another one for OR-IRFPA. The isolation wall with micrometer scale pores is designed to ensure air’s free flow between two cavities and prevent getter powder from harming pixels of OR-IRFPA. The infrared window is used as cover board and selectively transmitting 8–14 μm infrared radiation. Infrared images of human body are gotten by using the vacuum packaged OR-IRFPA, which shows the vacuum packaging method is feasible and useful for OR-IRFPA.