共 130 条
[1]
Segarra M.(2005)Kinetic equation describing the annealing process of copper J. Mater. Sci. 40 4483-4487
[2]
Martínez M.(2015)Structure, strength, and electric conductivity of a Cu‒Cr copper-based alloy subjected to severe plastic deformation Phys. Met. Metallogr. 116 209-218
[3]
Fernández M. A.(2004)Quantifying recrystallization by electron backscatter diffraction J. Microsc. 213 241-246
[4]
Chimenos J. M.(2010)Effect of Low Temperature Rolling on the Structure of Copper Phys. Met. Metallogr. 110 318-330
[5]
Espiell F.(2011)Evolution of texture and grain boundary microstructure in two-phase (α+β) brass during recrystallization Philos. Mag. 91 4089-4108
[6]
Sirvent N.(2010)Plastic deformation and creep damage evaluations of type 316 austenitic stainless steels by EBSD Mater. Charact. 61 913-922
[7]
Guixà O.(2011)A review of strain analysis using electron backscatter diffraction Microsc. Microanal 17 316-329
[8]
Islamgaliev R. K.(2006)Quantification of plastic strain of stainless steel and nickel alloy by electron backscatter diffraction Acta Mater. 54 539-548
[9]
Nesterov K. M.(2019)EBSD- and ECCI-based assessments of inhomogeneous plastic strain evolution coupled with digital image correlation ISIJ Int. 59 2334-2342
[10]
Valiev R. Z.(2007)The role of annealing twins during recrystallization of Cu Acta Mater. 55 4233-4241