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- [4] Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect Journal of Electronic Materials, 2009, 38 : 425 - 429
- [8] Interfacial reactions between Ni substrate and the component Bi in solders Journal of Electronic Materials, 1999, 28 : 57 - 62
- [9] Effect of Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni Interconnects 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 473 - 476