Interfacial Reactions Between Sn-Zn Alloys and Ni Substrates

被引：0
作者：
WenJun Zhu
HuaShan Liu
JinSan Wang
Guang Ma
ZhanPeng Jin
机构：
[1] Central South University,School of Materials Science and Engineering
[2] Central South University,The Key Lab of Non
[3] Northwest Institute for Non-Ferrous Metal Research,Ferrous Metal Materials Science and Engineering, Ministry of Education
来源：
Journal of Electronic Materials | 2010年 / 39卷
关键词：
Interfacial reaction; intermetallic compound; Sn-Zn alloy; Ni substrate;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Interfacial reactions between Sn-Zn alloys and Ni substrates after annealing at 463 K have been studied. Only one intermetallic compound (IMC), γ-Ni5Zn21, was observed at the Sn-Zn/Ni interfaces, although other IMC(s) in the Ni-Sn and Ni-Zn system can stably exist at this temperature. Taking into account nucleation along with diffusion kinetics, formation of the reaction product has been reasonably modeled. In addition, growth kinetics for the reaction layer has been quantified. The results indicate that the growth rate of the γ-Ni5Zn21 layer increases with Zn content, and that the layer growth obeys a parabolic law with annealing time, implying a diffusion-controlled mechanism.
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页码：209 / 214
页数：5
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