Interfacial Reactions Between Sn-Zn Alloys and Ni Substrates

被引：0

作者：

WenJun Zhu

HuaShan Liu

JinSan Wang

Guang Ma

ZhanPeng Jin

机构：

[1] Central South University,School of Materials Science and Engineering

[2] Central South University,The Key Lab of Non

[3] Northwest Institute for Non-Ferrous Metal Research,Ferrous Metal Materials Science and Engineering, Ministry of Education

来源：

Journal of Electronic Materials | 2010年 / 39卷

关键词：

Interfacial reaction; intermetallic compound; Sn-Zn alloy; Ni substrate;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Interfacial reactions between Sn-Zn alloys and Ni substrates after annealing at 463 K have been studied. Only one intermetallic compound (IMC), γ-Ni5Zn21, was observed at the Sn-Zn/Ni interfaces, although other IMC(s) in the Ni-Sn and Ni-Zn system can stably exist at this temperature. Taking into account nucleation along with diffusion kinetics, formation of the reaction product has been reasonably modeled. In addition, growth kinetics for the reaction layer has been quantified. The results indicate that the growth rate of the γ-Ni5Zn21 layer increases with Zn content, and that the layer growth obeys a parabolic law with annealing time, implying a diffusion-controlled mechanism.

引用

页码：209 / 214

页数：5

共 50 条

[21] Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates [J].

Chia-Wei Huang ;

Kwang-Lung Lin .

Journal of Electronic Materials, 2006, 35 :2135-2141

[22] Liquid-state interfacial reactions in Sn-Zn/Pd couples and phase equilibria of the Sn-Zn-Pd system at 260 °C [J].

Wang, Chao-hong ;

Li, Po-yi ;

Li, Kuan-ting .

INTERMETALLICS, 2015, 59 :68-74

[23] Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates [J].

Huang, Chia-Wei ;

Lin, Kwang-Lung .

JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (12) :2135-2141

[24] Characterization Alloys of the Sn-Zn System Produced by Melt Spinning [J].

Cordiolli Russi, Luis Gustavo ;

de Sousa, Luciola Lucena ;

Ramos, Alfeu Saraiva ;

Gargarella, Piter ;

Mariano, Neide Aparecida .

MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, 2019, 22 (01)

[25] Interfacial Reactions of Sn-9Zn-xCu (x=1, 4, 7, 10) Solders with Ni Substrates [J].

Liou, Wei-Kai ;

Yen, Yee-Wen ;

Jao, Chien-Chung .

JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (11) :2222-2227

[26] Interfacial Reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) Solders with Ni Substrates [J].

Wei-kai Liou ;

Yee-Wen Yen ;

Chien-Chung Jao .

Journal of Electronic Materials, 2009, 38 :2222-2227

[27] Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates [J].

Ching-Feng Yang ;

Sinn-Wen Chen ;

Kuan-Hsien Wu ;

Tsung-Shune Chin .

Journal of Electronic Materials, 2007, 36 :1524-1530

[28] Interfacial reactions of Sn-8wt.%Zn-3wt.%Bi solder with Cu, Ag, and Ni substrates [J].

Yang, Ching-Feng ;

Chen, Sinn-Wen ;

Wu, Kuan-Hsien ;

Chin, Tsung-Shune .

JOURNAL OF ELECTRONIC MATERIALS, 2007, 36 (11) :1524-1530

[29] Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying [J].

M.L. Huang ;

C.M.L. Wu* ;

J.K.L. Lai ;

L. Wang ;

F. G. Wang .

Journal of Materials Science: Materials in Electronics, 2000, 11 :57-65

[30] Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing [J].

Wang, Chao-hong ;

Li, Po-yi ;

Li, Kuan-ting .

JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (12) :4594-4601

← 1 2 3 4 5 →