共 25 条
- [1] Bustillo JM(1998)Surface micromachining for microelectromechanical systems P IEEE 86 1552-1574
- [2] Howe RT(2001)Microelectromechanical systems (MEMS): fabrication, design and applications Smart Mater Struc 10 1115-1134
- [3] Muller RS(1998)Bulk micromachining of silicon P IEEE 86 1536-1551
- [4] Judy JW(1986)Wafer bonding for silicon-on-insulator technologies Appl Phys Lett 48 78-1585
- [5] Kovacs GTA(1988)Bonding of silicon wafers for silicon-on-insulator J Appl Phys 64 4943-1626
- [6] Maluf NI(1982)Silicon as a mechanical material Proc of IEEE 70 420-823
- [7] Petersen KE(1998)Wafer-to-wafer bonding for microstructure formation P IEEE 86 1575-243
- [8] Lasky JB(1998)CAD challenges for microsensors, microactuators, and micro-systems P IEEE 86 1611-524
- [9] Maszara WP(1986)Silicon-on-silicon direct wafer bonding method J Appl Phys 60 2987-522
- [10] Goetz G(2003)Developments in microelectromechanical systems (MEMS): a manufacturing perspective J Manuf Sci Eng 125 816-undefined