Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration

被引：0

作者：

Yi-Qi Wang

Byung-Han Ko

Sang-Geuk Jeong

Kyoung-Su Park

No-Cheol Park

Young-Pil Park

机构：

[1] Yonsei University,Department of Mechanical Engineering

来源：

Microsystem Technologies | 2015年 / 21卷

关键词：

Print Circuit Board; Vibration Amplitude; Smart Phone; Acoustic Noise; Piezoelectric Coefficient;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Owing to their superior electrical performance, multilayer ceramic capacitors (MLCCs) are widely applied in a variety of electronic devices. The acoustic noise of MLCCs is an important factor to be considered when selecting MLCCs for specific applications, such as smart phones. This noise is directly related to the vibration of the printed circuit board (PCB) on which MLCCs are mounted. Therefore, to improve the noise and vibration characteristics, this paper investigated the effects of soldering parameters on PCB vibration. Based on the findings, a novel soldering method that reduces vibration is described.

引用

页码：2565 / 2571

页数：6