Static and dynamic fracture analysis for the interface crack of isotropic-orthotropic bimaterial

被引：0
作者：
Kwang Ho Lee
Arun Shukla
Venkitanarayanan Parameswaran
Vijaya Chalivendra
Jae Sug Hawong
机构：
[1] University of Rhode Island,Department of Mechanical Engineering and Applied Mechanics
[2] Yeoungnam University,Department of Mechanical Engineering
[3] Sangju National University,Department of Mechanical Engineering
来源：
KSME International Journal | 2002年 / 16卷
关键词：
Static and Dynamic Stress Intensity Factor; Interface Crack; Isotropic-Orthotropic Bimaterial Energy Release Rate; Photoelasticity;
D O I：
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中图分类号：
学科分类号：
摘要：
In the present study, interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static cracks are greater when α=90° (fibers perpendicular to the interface) than when α=0° (fibers parallel to the interface), and those when α=90° are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating cracks are greater when α=0° than α=90°. For the velocity ranges (0.1<c/cs1<0.7) observed in this study, the complex dynamic stress intensity factor |KD|, I increases with crack speedc, however, the rate of increase of |KD| with crack speed is not as drastic as that reported for homogeneous materials.
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页码：165 / 174
页数：9
相关论文
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