Deposition of Ni-Al coatings onto copper by mechanical/heat treatment

被引：3

作者：

Sytschev A.E. ^{[1
]}

Busurin S.M. ^{[1
]}

Kovalev D.Y. ^{[1
]}

Vrel D. ^{[2
]}

Boyarchenko O.D. ^{[1
]}

Sachkova N.V. ^{[1
]}

机构：

[1] Institute of Structural Macrokinetics and Materials Science, Russian Academy of Sciences, Chernogolovka

[2] LSPM, Université Paris 13, UPR 3407-CNRS 99, Villetaneuse 93430, Avenue J.-B. Clément

来源：

International Journal of Self-Propagating High-Temperature Synthesis | 2013年 / 22卷 / 2期

关键词：

mechanical activation; Ni-Al coatings; Ni-Al-Cu system; SHS;

D O I：

10.3103/S1061386213020106

中图分类号：

学科分类号：

摘要：

The transition layer formed upon deposition of Ni-Al coatings onto the surface of Cu substrates by using the technique of mechanical treatment followed by annealing was found to contain α-(Cu,Ni) solid solution, Cu 9Al4, Ni3Al, NiAl, Ni2Al 3, and NiAl3. The mechanism for formation of protective coating in the Ni-Al-Cu system was discussed. © 2013 Allerton Press, Inc.

引用

页码：103 / 109

页数：6

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