Evolution of Annealing Twins in Sputtered Cu Films

The Monte Carlo Potts model with n-fold method was used to simulate grain structure evolution in thin Cu films according to energetic competition principles. Surface/interface, grain boundary, and strain energy factors were applied to determine grain growth and crystallographic texture evolution as a function of film thickness. Furthermore, annealing twins were simulated through specific criteria that arbitrarily insert twin grains into the structure through grain boundary energy considerations. Four different types of microstructures were observed experimentally and simulated by the Monte Carlo technique.