SOI wafer mold with high-aspect-ratio microstructures for hot embossing process

被引:0
作者
Y. Zhao
T. Cui
机构
[1] Louisiana Tech University,Institute for Micromanufacturing
来源
Microsystem Technologies | 2004年 / 10卷
关键词
Silicon; Microstructure; Mold; Aspect Ratio; PMMA;
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中图分类号
学科分类号
摘要
This paper reports using a Silicon oil insulator (SOI) wafer as a mold insert for the hot embossing process on high-aspect-ratio microstructures to overcome two drawbacks of Inductive Coupled Etching (ICP) process, the area dependent etching and the micrograss. A thin sacrificial wall to eliminate the undercut in the big open area during ICP etching is also described. A good result of final embossed structure on PMMA with aspect ratio of 12 : 1, uniform thickness, and smooth surface is presented.
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页码:544 / 546
页数:2
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