Recycling Glass Fiber/Epoxy Resin of Waste Printed Circuit Boards: Morphology and Mechanical properties

被引：0
|
作者：
R. Dangtungee
S. Somchua
S. Siengchin
机构：
[1] King Mongkut’s University of Technology North Bangkok,Department of Industrial Chemistry, Faculty of Applied Science
[2] King Mongkut’s University of Technology North Bangkok,Research Center of Nano Industries and Biopolymer, Science and Technology Research Institute
[3] King Mongkut’s University of Technology North Bangkok,The Sirindhorn International Thai
来源：
Mechanics of Composite Materials | 2012年 / 48卷
关键词：
glass fiber; composite; recycling; epoxy resin; printed circuit board;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Various composites were prepared from recycled waste printed circuit boards and an epoxy resin, and some of their mechanical properties (hardness, elongation at break, tensile and flexural strengths and moduli, and impact energy) were determined experimentally. The results obtained are presented in the form of diagrams.
引用
收藏
页码：325 / 330
页数：5
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