Material removal mechanism in ultrasonic-assisted grinding of Al2O3 by single-grain scratch test

Alumina is an advanced ceramic that is frequently used in high-performance applications. Grinding of alumina is usually associated with micro-cracks and deteriorated surface quality. Ultrasonic-assisted grinding has been introduced in several applications as a promising method to overcome these constraints. In order to get a deeper knowledge of the characteristics of material removal mechanisms in alumina during grinding with ultrasonic stimulation of the workpiece, single-grain scratch tests were performed and the theoretical and experimental kinematics of grain-workpiece engagement were investigated. It was shown that in the real contact conditions, interrupted contact conditions happen, which is analogous to the theoretical model. The measured workpiece resonance frequency and mode shape were very close to the design conditions. The investigations show that the superposition of ultrasonic vibration into the grinding process increases the material removal of each grain. This result fully correlates with the presented theoretical analysis. Additionally, it was found that the impact action of ultrasonic-assisted grinding induces chipping around the produced scratch.