Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current Stressing

被引：0
作者：
B.Y. Wu
M.O. Alam
Y.C. Chan
H.W. ZHONG
机构：
[1] City University of Hong Kong,Department of Electronic Engineering
来源：
Journal of Electronic Materials | 2008年 / 37卷
关键词：
Joule heating; phase coarsening; ball grid array (BGA) solder joints; current stressing; diffusion;
D O I：
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学科分类号：
摘要：
This paper investigated the effect of Joule heating on the phase coarsening in Sn37Pb and Sn3.5Ag0.5Cu ball grid array (BGA) solder joints stressed at −5°C and 125°C with a 6.0 × 102 A/cm2 electric current. The phase growth under current stressing was also compared with those under aging at 125°C. It was found that the current stressing produced a substantial Joule heating in the solder joints and conductive traces. Hence, the solder joints underwent a considerable temperature rise by 30–35°C when stressed at −5°C and 125°C in this study. Coarsening of Pb-rich and Ag-rich phases was confirmed to be accelerated by the current stressing as a result of enhanced diffusion at elevated temperature and atomic stimulation due to numerous collisions between electrons and atoms. Different controlling kinetics were suggested for the cases stressed or aged at different temperatures.
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页码：469 / 476
页数：7
相关论文
共 59 条
  • [1] Liu S.H.(2004)undefined J. Appl. Phys. 95 7742-undefined
  • [2] Chen C.(2005)undefined J. Mater. Res. 20 2184-undefined
  • [3] Liu P.C.(2005)undefined J. Mater. Res. 20 2432-undefined
  • [4] Chou T.(2005)undefined J.␣Electron. Mater. 34 27-undefined
  • [5] Liu Y.H.(2004)undefined Acta Mater. 52 129-undefined
  • [6] Lin K.L.(2001)undefined Microelectron. J. 32 605-undefined
  • [7] Chen Y.H.(2003)undefined Int. J. Solids Struct. 40 4021-undefined
  • [8] Shao T.L.(2004)undefined Thin Solid Films 462–463 413-undefined
  • [9] Chen C.(2006)undefined Microelectr. Reliab. 46 41-undefined
  • [10] Lin Y.H.(2003)undefined J. Appl. Phys. 94 5451-undefined
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