Effect of sintering atmospheres on printed silver nanoparticle patterns for flexible electronics application

被引:0
作者
Seonhee Jang
Muhibbur Rahman
机构
[1] University of Louisiana at Lafayette,Department of Mechanical Engineering
来源
Applied Physics A | 2021年 / 127卷
关键词
Silver nanoparticles; Sintering; Formic acid; Electrical resistivity; Hardness; Elastic modulus;
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学科分类号
摘要
A unique atmosphere using formic acid was introduced to sinter silver (Ag) nanoparticles (NPs) for conductive patterns applicable for flexible electronics. Printed Ag NP patterns on flexible polyimide sheets using Ag NP ink were sintered in the atmosphere selected from air, N2, or N2-bubbled formic acid (N2-FA). Microstructures, organic residues, and electrical and mechanical properties of the sintered Ag patterns were compared, depending on sintering parameters including atmosphere, temperature, and time. The Ag NP patterns sintered in N2-FA atmosphere revealed an effective decomposition of organic materials, resulting in lower electrical resistivities and improved mechanical properties. For the Ag NP patterns sintered in N2-FA, organic residues were obtained below 5 wt% and grain sizes increased to 30–31 nm when the sintering temperature increased from 80 to 140 °C and sintering time increased up to 12 min. Less amount of organic residues and larger grain sizes contributed to achieving lower electrical resistivity of 15.7 μΩ-cm and higher hardness and modulus with their respective values of 0.184 and 8.405 GPa. The Ag NP patterns sintered in N2-FA resulted in improved electrical and mechanical properties in comparison with those sintered in air or N2. The Ag NP patterns sintered in N2-FA had enough electrical conductivity to operate light emitting diode lamps and were used to fabricate a radio frequency identification (RFID) antenna tag. From the measurement of the return loss (S11) in the RFID tags, the antenna showed a dual-band feature with two resonance frequencies of 27.76 and 33.50 MHz, which gave the ability to receive and send information in both frequencies.
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[61]  
Kwon S-K(2018)Reduction of copper oxide film to elemental copper Adv. Mater. Interfaces 1 572-undefined
[62]  
Kim Y(2013)Truly low temperature sintering of printed copper ink using formic acid J. Mater. Chem. C 649 687-undefined
[63]  
Foudeh AM(2015)Controlling the thickness of the surface oxide layer on Cu nanoparticles for the fabrication of conductive structures by ink-jet printing J. Alloys Compd. 4 8522-undefined
[64]  
Ehrlich A(2016)Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: microstructure, resistivity, oxidation resistance, and long-term stability J. Mater. Chem. C 459 249-undefined
[65]  
Gasperini A(2018)Highly densified Cu wirings fabricated from air-stable Cu complex ink with high conductivity, enhanced oxidation resistance, and flexibility Appl. Surf. Sci. 10 1627-undefined
[66]  
Yun Y(2020)Highly conductive short chain carboxylic acid encapsulated silver nanoparticle based inks for direct write technology applications Nanomaterials 33 223-undefined
[67]  
Murmann B(1989)Controllable synthesis and sintering of silver nanoparticles for inkjet-printed flexible electronics Prog. Mater. Sci. 51 801-undefined
[68]  
Tok JBH(2004)Low-temperature sintering of highly conductive silver ink for flexible electronics Scr. Mater. 9 130-undefined
[69]  
Bao Z(2019)Fabrication of highly conductive and flexible printed electronics by low temperature sintering reactive silver ink Int. J. Eng. Adv. Technol. 28 1074-undefined
[70]  
Liang J(2018)Comparing methods for calculating nano crystal size of natural hydroxyapatite using X-ray diffraction IEEE Microw. Wirel. Compon. Lett. 6 5387-undefined