Micro-channel fabrication on silicon wafer (100) using Rotary Ultrasonic Machining

被引：0
作者：
T. G. Mamatha
Mohit Vishnoi
Siddharth Srivastava
Vansh Malik
Mudit K. Bhatnagar
机构：
[1] JSS Academy of Technical Education,Department of Mechanical Engineering
来源：
Silicon | 2022年 / 14卷
关键词：
Rotary Ultrasonic Machining; Material Removal Rate; Surface Roughness; Silicon Wafer;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
In the Present work Rotary Ultrasonic machining is used for fabrication of micro channel on Silicon wafer. Silicon wafer possesses a plethora of applications, from their use in electronics, to energy applications. This experimental research focuses on augmenting the efficiency of machining parameters. The parameters considered are feed rate, rotation speed of the tool and the mesh size of abrasive particle to evaluate Material Removal Rate and Surface Roughness. Analysis of variance has been used to optimise the process parameter.
引用
收藏
页码：10271 / 10290
页数：19
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