Insights into the Corrosion Inhibition Potential of Chenopodium ambrosioides Extract for Copper in Molar HCl Medium

被引:0
作者
Benzbiria N. [1 ]
Echihi S. [2 ,3 ]
Thoume A. [1 ]
Warad I. [4 ]
Zarrouk A. [3 ]
Chebabe D. [2 ]
Left D.B. [1 ]
Azzi M. [1 ]
Zertoubi M. [1 ]
机构
[1] Laboratory of Interface Materials Environment, Faculty of Sciences Ain Chock, Hassan II University, Maârif, Casablanca
[2] Laboratory of Materials Engineering for the Environment and Natural Resources, Faculty of Sciences and Techniques, University Moulay Ismail of Meknes, BP 509 Boutalamine 52000, Errachidia
[3] Laboratory of Materials, Nanotechnology, and Environment, Faculty of Sciences, Mohammed V University in Rabat, P.O. Box. 1014, Rabat
[4] Department of Chemistry, AN-Najah National University, P.O. Box 7, Nablus
关键词
Contact angle; Copper corrosion; Environmentally friendly inhibitor; PDP/EIS; SEM/FT-IR;
D O I
10.1007/s40735-023-00815-z
中图分类号
学科分类号
摘要
In this work, weight-loss measurements (WL), electrochemical impedance spectroscopy (EIS), and potentiodynamic polarization curves (PDP) were employed to examine the inhibitive action of Chenopodium Ambrosidoides Extract (CAE) in 1M hydrochloric acid on copper surface. Fourier-transform infrared (FT-IR) spectroscopy was utilized to evaluate the main functional groups of CAE. The latter has shown to be a very effective mixed-type inhibitor. The inhibitory efficiency (IE) improved as CAE concentration increased to a value of 91% after one-hour exposure to 1M HCl containing 300 ppm of the inhibitor. However, the IE declined as the temperature increased due to the desorption of CAE molecules from copper surface. The results gathered from WL measurements, PDP, and EIS were in good agreements. According to thermodynamic calculations, Chenopodium Ambrosidoides extract adsorption on copper surface in 1M HCl followed the Langmuir isotherm. The inhibitory function of CAE was further confirmed by surface analysis and UV–Visible investigations. Results outlined that CAE adsorbed on Cu surface and developed a relatively hydrophobic protective film. The latter prevented copper dissolution and limited the accessibility of attacking ions as evinced by solution analysis techniques. © 2024, The Author(s), under exclusive licence to Springer Nature Switzerland AG.
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