Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps

被引：0
作者：
Gahui Kim
Kirak Son
Jang-Hee Lee
Young-Chang Joo
Young-Bae Park
机构：
[1] Andong National University,School of Materials Science and Engineering
[2] SK Hynix Inc.,Department of Materials Science and Engineering
[3] Seoul National University,undefined
来源：
Electronic Materials Letters | 2022年 / 18卷
关键词：
Electromigration; Joule heating; Pb-free solder bump; jL product; Lifetime;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：431 / 439
页数：8
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