Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test

被引:0
|
作者
Ning Zhang
Yaowu Shi
Zhidong Xia
Yongping Lei
Fu Guo
Xiaoyan Li
机构
[1] Beijing University of Technology,College of Materials Science and Engineering
来源
Journal of Electronic Materials | 2008年 / 37卷
关键词
Impact test; lead-free; intermetallic compound; RE elements;
D O I
暂无
中图分类号
学科分类号
摘要
Charpy impact tests on three kinds of as-soldered U-notch specimens were performed with reference to the American Society of Testing Materials (ASTM) standard E23-07 by using a pendulum-type impact tester at room temperature. Three kinds of solders, conventional Sn-37Pb, Sn-3.8Ag-0.7Cu, and Sn-3.8Ag-0.7Cu doped with rare-earth (RE) elements, were selected to fabricate the joint specimens for the impact test. The three joints demonstrate similar impact toughness values, with averages of 11.4 kJ/m2, 10.4 kJ/m2, and 11.0 kJ/m2, respectively. Under observation by scanning electron microscopy (SEM), the Sn-37Pb joint exhibited mainly ductile fracture morphology. Fractographic observations of lead-free joints exhibited a mixture of ductile and brittle morphologies. The addition of RE elements resulted in an impact toughness that was slightly higher than that of the Sn-3.8Ag-0.7Cu alloy. The impact toughness and the fracture mode were notably dependent on the type of solder. Additionally, the thickness of the intermetallic compound (IMC) layer had a remarkable influence on the fracture path and impact toughness of the solder joints.
引用
收藏
页码:1631 / 1639
页数:8
相关论文
共 2 条
  • [1] Comparison of impact toughness and fracture morphologies between Pb-containing and Pb-free solder joints subject to the Charpy impact test
    Zhang, Ning
    Shi, Yaowu
    Xia, Zhidong
    Lei, Yongping
    Guo, Fu
    Li, Xiaoyan
    JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (10) : 1631 - 1639
  • [2] Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test
    Zhang, Ning
    Shi, Yaowu
    Guo, Fu
    Lei, Yongping
    Xia, Zhidong
    Chen, Zhenhua
    Tian, Li
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 22 (03) : 292 - 298