Loop Thermosyphon for Cooling Heat-Loaded Electronics Components

The thermal properties of a loop thermosyphon made of copper with a horizontally located evaporator, covered by a porous coating, and a condenser intended for cooling powerful electronic devices and transferring heat fluxes with a power of 1 kW and above have been studied. The characteristics of thermosyphon evaporators having capillary structures and liquid- and air-cooled condensers of various types were studied experimentally. It is shown that coating the capillary grooves by a thin layer of sintered powder makes it possible to more than halve the thermal resistance of the thermosyphon evaporator and that, with a condenser cooled by air, the total thermal resistance of the device does not exceed 0.1°C/W.