Loop Thermosyphon for Cooling Heat-Loaded Electronics Components

被引：0
作者：
L. L. Vasiliev
A. S. Zhuravlyov
M. A. Kuz′mich
V. K. Kulikovskii
V. A. Olekhnovich
机构：
[1] A. V. Luikov Heat and Mass Transfer Institute of the National Academy of Sciences of Belarus,
来源：
Journal of Engineering Physics and Thermophysics | 2023年 / 96卷
关键词：
Heat pipe; Thermosyphon; Heat exchange; Cooling; Phase transition; Porous wick;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The thermal properties of a loop thermosyphon made of copper with a horizontally located evaporator, covered by a porous coating, and a condenser intended for cooling powerful electronic devices and transferring heat fluxes with a power of 1 kW and above have been studied. The characteristics of thermosyphon evaporators having capillary structures and liquid- and air-cooled condensers of various types were studied experimentally. It is shown that coating the capillary grooves by a thin layer of sintered powder makes it possible to more than halve the thermal resistance of the thermosyphon evaporator and that, with a condenser cooled by air, the total thermal resistance of the device does not exceed 0.1°C/W.
引用
收藏
页码：1708 / 1715
页数：7
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