Theoretical estimation of coefficient of thermal expansion for solder alloy

被引：0

作者：

Boon Kwang Lee

Hong Mei Jin

Ping Wu

机构：

[1] National University of Singapore,Singapore

[2] Institute of High Performance Computing,MIT Alliance, High Performance Computing for Engineered Systems

来源：

Journal of Materials Science | 2003年 / 38卷

关键词：

Polymer; Correlation Function; Thermal Expansion; Excellent Agreement; Simple Approach;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Coefficient of thermal expansion (CTE) of solder alloy Sn-37%Pb was estimated by using cluster expansion method. Five phases with available experimental CTE in Sn-Pb system were employed to derive the correlation coefficient, qi. Monte-Carlo simulation was carried out to obtain the correlation functions, ξi. With the derived qi and ξi, CTE of Sn-37%Pb was calculated, which is in excellent agreement with experiment. This study may provide a simple approach for the CTE prediction of disordered structures.

引用

页码：1135 / 1137

页数：2

共 25 条

[1] Abtew M.(2000)undefined Mater. Sci. Eng. 27 95-undefined
[2] Selvaduray G.(1997)undefined Phys. Rev. B 55 7767-undefined
[3] Quong A. A.(2000)undefined Phil. Mag. Lett. 80 683-undefined
[4] Liu A. Y.(1994)undefined Phys. Rev. B 49 627-undefined
[5] Fu C. L.(2000)undefined Phys. Rev. B 62 237-undefined
[6] Wang X.(1991)undefined Phys. Rev. B 44 5411-undefined
[7] Wolverton C.(1996)undefined Calphad V 20 481-undefined
[8] Fontaine D. d.(1987)undefined Phys. Rev. B 35 2169-undefined
[9] Alonso P. R.(1994)undefined Prog. Theor. Phys. Supp. 115 147-undefined
[10] Rubiolo G. H.(1983)undefined Phys. Rev. B 27 5169-undefined

← 1 2 3 →