Nanoscale Wire Bonding of Individual Ag Nanowires on Au Substrate at Room Temperature

[1] Xu H(2010)A micromechanism study of thermosonic gold wire bonding on aluminum pad J. Appl. Phys. 108 113517-300

[2] Liu C(2014)Joining of individual silver nanowires via electrical current Nano-Micro Lett. 6 293-1163

[3] Silberschmidt VV(2013)Effect of the direct current on microstructure, tensile property and bonding strength of pure silver wires Microelectron. Reliab. 53 1159-1098

[4] Pramana S(2012)Challenges and developments of copper wire bonding technology Microelectron. Reliab. 52 1092-80

[5] White TJ(2011)Nickel–palladium bond pads for copper wire bonding Microelectron. Reliab. 51 75-608

[6] Chen Z(2012)Thermal stability of grain structure and material properties in an annealing-twinned Ag–8Au–3Pd alloy wire Scr. Mater. 67 605-366

[7] Sivakumar M(2014)Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads Acta Mater. 64 356-12618

[8] Acoff V(2015)Joining of silver nanomaterials at low temperatures: processes, properties, and applications ACS Appl. Mater. Interfaces 7 12597-60

[9] Vafaei A(2009)A review of micro/nano welding and its future developments Recent Pat. Nanotechnol. 3 53-63

[10] Hu A(2007)Nanorobotic spot welding: controlled metal deposition with attogram precision from copper-filled carbon nanotubes Nano Lett. 7 58-956

[1] Xu H(2010)A micromechanism study of thermosonic gold wire bonding on aluminum pad J. Appl. Phys. 108 113517-300

[2] Liu C(2014)Joining of individual silver nanowires via electrical current Nano-Micro Lett. 6 293-1163

[3] Silberschmidt VV(2013)Effect of the direct current on microstructure, tensile property and bonding strength of pure silver wires Microelectron. Reliab. 53 1159-1098

[4] Pramana S(2012)Challenges and developments of copper wire bonding technology Microelectron. Reliab. 52 1092-80

[5] White TJ(2011)Nickel–palladium bond pads for copper wire bonding Microelectron. Reliab. 51 75-608

[6] Chen Z(2012)Thermal stability of grain structure and material properties in an annealing-twinned Ag–8Au–3Pd alloy wire Scr. Mater. 67 605-366

[7] Sivakumar M(2014)Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads Acta Mater. 64 356-12618

[8] Acoff V(2015)Joining of silver nanomaterials at low temperatures: processes, properties, and applications ACS Appl. Mater. Interfaces 7 12597-60

[9] Vafaei A(2009)A review of micro/nano welding and its future developments Recent Pat. Nanotechnol. 3 53-63

[10] Hu A(2007)Nanorobotic spot welding: controlled metal deposition with attogram precision from copper-filled carbon nanotubes Nano Lett. 7 58-956