Relation of Sn whisker formation to intermetallic growth: Results from a novel Sn-Cu "bimetal ledge specimen"

被引：17

作者：

Reinbold, Lucine ^{[1
]}

Jadhav, Nitin ^{[1
]}

Chason, Eric ^{[1
]}

Kumar, K. Sharvan ^{[1
]}

机构：

[1] Brown Univ, Div Engn, Providence, RI 02912 USA

来源：

JOURNAL OF MATERIALS RESEARCH | 2009年 / 24卷 / 12期

基金：

美国国家科学基金会;

关键词：

DYNAMIC EMBRITTLEMENT; GRAIN-BOUNDARIES; TIN; BICRYSTALS; ALLOY; ZINC;

D O I：

10.1557/JMR.2009.0431

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Sn whisker formation was studied in a "bimetal ledge specimen" that consisted of a uniform layer of Sri that was covered by Cu on only half the sample. Whiskers are observed to grow in the Cu-free region of the sample, which is attributed to stress generated by the diffusion of Sri atoms along the network of columnar grain boundaries. The Sri diffusion is driven by intermetallic growth, but the whisker density extends out much further than any measurable Cu concentration. Whiskers were also observed to grow in the Cu-coated region by punching through the overlayer, leaving a Cu-grain on the tip of the Sri whisker.

引用

页码：3583 / 3589

页数：7

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