Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate

被引：0
作者：
X. F. Zhang
J. D. Guo
J. K. Shang
机构：
[1] Chinese Academy of Sciences,Shenyang National Laboratory for Materials Science, Institute of Metal Research
[2] University of Illinois at Urbana-Champaign,Department of Materials Science and Engineering
来源：
Journal of Electronic Materials | 2010年 / 39卷
关键词：
Polarity effect; current stressing; effective charge; FeNi; interfacial reactions;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The effect of polarity on interfacial reactions under high-density electric current was investigated in Cu/FeNi/Sn/FeNi/Cu solder interconnects. A reverse polarity effect was found where the FeSn2 intermetallic compound (IMC) layer at the cathode grew significantly thicker than that at the anode under electric loading. Such an abnormal polarity effect was shown to result from electromigration of Fe in the direction opposite to the electron flow. At the same time, a Cu-rich layer developed next to the FeSn2 layer at the anode side. Kinetic analysis of Fe and Cu mass transport explained the differential growth of the IMCs at the two electrodes, in good agreement with the experimental data.
引用
收藏
页码：333 / 337
页数：4
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