A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy

被引：185
作者：
Ioannis Chasiotis
Wolfgang G. Knauss
机构：
[1] University of Virginia,Mechanical and Aerospace Engineering
[2] California Institute of Technology,Graduate Aeronautical Laboratories
来源：
Experimental Mechanics | 2002年 / 42卷 / 1期
关键词：
Mechanical properties; microtensile testing; AFM; digital image correlation; MEMS;
D O I：
10.1007/BF02411051
中图分类号：
学科分类号：
摘要：
An apparatus has been designed and implemented to measure the elastic tensile properties (Young's modulus and tensile strength) of surface micromachined polysilicon specimens. The tensile specimens are “dog-bone” shaped ending in a large “paddle” for convenient electrostatic or, in the improved apparatus, ultraviolet (UV) light curable adhesive gripping deposited with electrostatically controlled manipulation. The typical test section of the specimens is 400 μm long with 2 μm×50 μm cross section. The new device supports a nanomechanics method developed in our laboratory to acquire surface topologies of deforming specimens by means of Atomic Force Microscopy (AFM) to determine (fields of) strains via Digital Image Correlation (DIC). With this tool, high strength or non-linearly behaving materials can be tested under different environmental conditions by measuring the strains directly on the surface of the film with nanometer resolution.
引用
收藏
页码：51 / 57
页数：6
相关论文
共 36 条
[1]  
Sharpe W.N.(1998)Round Robin Tests of Modulus and Strength of Polysilicon Proc. MRS 518 57-65
[2]  
Brown S.(1998)Mechanical Evaluation of Polysilicon Properties by Means of Probe Microscopy Proc. SPIE 3512 66-75
[3]  
Johnson G.C.(1999)Tensile Testing of Polysilicon J. Exp. Mech. 39 162-170
[4]  
Knauss W.G.(1997)In Situ Tensile Strength Measurement and Weibull Analysis of Thick Film and Thin Film Micromachined Polysilicon Structures Thin Solid Films 292 247-254
[5]  
Chasiotis I.(1993)Microtensile Testing of Free-Standing Polysilicon Fibers of Various Grain Sizes J. Micromech. Microeng. 3 13-17
[6]  
Knauss W.G.(1996)Tensile Testing of Polycrystalline Silicon Thin Films Using Electrostatic Force Grip T. IEE Japan 116-E 441-446
[7]  
Sharpe W.N.(1995)Variations in Young's Modulus and Intrinsic Stress of LPCVD Polysilicon due to High-Temperature Annealing J. Micromech. Microeng. 5 121-124
[8]  
Turner K.T.(1997)Error Limitations in the Determination of Mechanical Properties of Thin Films J. Reinforced Plastic and Composites 16 17-32
[9]  
Edwards R.L.(1998)Submicron Deformation Field Measurements II: Improved Digital Image Correlation Experimental Mechanics 38 86-92
[10]  
Greek S.(1983)Determination of Displacements Using an Improved Digital Image Correlation Method Image Vision Computing 1 133-139
1234