Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

被引：0

作者：

Wang K.-J. ^{[1
]}

Tsai Y.-Z. ^{[1
]}

Duh J.-G. ^{[1
]}

Shih T.-Y. ^{[1
,2
]}

机构：

[1] Department of Materials Science and Engineering, National Tsing Hua University

[2] United Microelectronics Corporation

来源：

Journal of Materials Research | 2009年 / 24卷 / 8期

关键词：

D O I：

10.1557/jmr.2009.0315

中图分类号：

学科分类号：

摘要：

An Sn-patch formed in Ni(V)-based under bump metallization during reflow and aging. To elucidate the evolution of the Sn-patch, the detailed compositions and microstructure in Sn-Ag-Cu and Ti/Ni(V)/Cu joints were analyzed by a field emission electron probe microanalyzer (EPMA) and transmission electron microscope (TEM), respectively. There existed a concentration redistribution in the Sn-patch, and its microstructure also varied with aging. The Sn-patch consisted of crystalline Ni and an amorphous Sn-rich phase after reflow, whereas V2Sn3 formed with amorphous an Sn-rich phase during aging. A possible formation mechanism of the Sn-patch was proposed. © 2009 Materials Research Society.

引用

页码：2638 / 2643

页数：5

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