Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

被引：0

作者：

Wang K.-J. ^{[1
]}

Tsai Y.-Z. ^{[1
]}

Duh J.-G. ^{[1
]}

Shih T.-Y. ^{[1
,2
]}

机构：

[1] Department of Materials Science and Engineering, National Tsing Hua University

[2] United Microelectronics Corporation

来源：

Journal of Materials Research | 2009年 / 24卷 / 8期

关键词：

D O I：

10.1557/jmr.2009.0315

中图分类号：

学科分类号：

摘要：

An Sn-patch formed in Ni(V)-based under bump metallization during reflow and aging. To elucidate the evolution of the Sn-patch, the detailed compositions and microstructure in Sn-Ag-Cu and Ti/Ni(V)/Cu joints were analyzed by a field emission electron probe microanalyzer (EPMA) and transmission electron microscope (TEM), respectively. There existed a concentration redistribution in the Sn-patch, and its microstructure also varied with aging. The Sn-patch consisted of crystalline Ni and an amorphous Sn-rich phase after reflow, whereas V2Sn3 formed with amorphous an Sn-rich phase during aging. A possible formation mechanism of the Sn-patch was proposed. © 2009 Materials Research Society.

引用

页码：2638 / 2643

页数：5

共 50 条

[21] Elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-bump metallization during aging
Jang, Guh-Yaw
Duh, Jenq-Gong
JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (11) : 2061 - 2070
[22] Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization
Huang, CP
Chen, C
Liu, CY
Lin, SS
Chen, KH
JOURNAL OF MATERIALS RESEARCH, 2005, 20 (10) : 2772 - 2779
[23] Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization
Chang Pin Huang
Chih Chen
C. Y. Liu
S. S. Lin
K. H. Chen
Journal of Materials Research, 2005, 20 : 2772 - 2779
[24] Characterizing metallurgical reaction of Sn-Pb solder with Ni/Cu under-bump metallization by electron microscopy
Hsiao, LY
Duh, JG
THIN SOLID FILMS, 2004, 469 : 366 - 371
[25] The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization
Bi, Jinglin
Hu, Anmin
Li, Ming
Mao, Dali
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 369 - 373
[26] Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps
Huang, CS
Jang, GY
Duh, JG
JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (04) : 283 - 289
[27] Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering
Kai-Zheng Wang
Chih-Ming Chen
Journal of Electronic Materials, 2005, 34 : 1543 - 1549
[28] Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps
Chien-Sheng Huang
Guh-Yaw Jang
Jenq-Gong Duh
Journal of Electronic Materials, 2004, 33 : 283 - 289
[29] Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering
Wang, KZ
Chen, CM
JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (12) : 1543 - 1549
[30] Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package
Huang, CS
Duh, JG
Chen, YM
JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (12) : 1509 - 1514

← 1 2 3 4 5 →