Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

被引：0
|
作者：
Wang K.-J. [1 ]
Tsai Y.-Z. [1 ]
Duh J.-G. [1 ]
Shih T.-Y. [1 ,2 ]
机构：
[1] Department of Materials Science and Engineering, National Tsing Hua University
[2] United Microelectronics Corporation
来源：
Journal of Materials Research | 2009年 / 24卷 / 8期
关键词：
D O I：
10.1557/jmr.2009.0315
中图分类号：
学科分类号：
摘要：
An Sn-patch formed in Ni(V)-based under bump metallization during reflow and aging. To elucidate the evolution of the Sn-patch, the detailed compositions and microstructure in Sn-Ag-Cu and Ti/Ni(V)/Cu joints were analyzed by a field emission electron probe microanalyzer (EPMA) and transmission electron microscope (TEM), respectively. There existed a concentration redistribution in the Sn-patch, and its microstructure also varied with aging. The Sn-patch consisted of crystalline Ni and an amorphous Sn-rich phase after reflow, whereas V2Sn3 formed with amorphous an Sn-rich phase during aging. A possible formation mechanism of the Sn-patch was proposed. © 2009 Materials Research Society.
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页码：2638 / 2643
页数：5
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