Compressive failure mechanism of sintered nano-silver

被引:0
作者
Gong He
Guo Hongcun
Li Shujin
Zhou Junwen
Yao Yao
机构
[1] Changzhou Institute of Technology,School of Civil Engineering and Architecture
[2] Changzhou Institute of Technology,Industrial College of Carbon Fiber and New Materials
[3] Northwestern Polytechnical University,School of Mechanics, Civil Engineering and Architecture
[4] Xi’an University of Architecture and Technology,School of Civil Engineering
来源
Journal of Materials Research | 2023年 / 38卷
关键词
Sintered nano-silver; Compressive properties; Voids; Finite element analysis; Electronic packaging;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:4201 / 4213
页数:12
相关论文
共 50 条
[21]   Size Effect Between Micron-Silver Joint and Nano-Silver Joint in Die-Attached Interconnection [J].
Gong, He ;
Yang, Yuting ;
Wu, Hongcheng ;
Chen, Xiangchen ;
Yao, Yao .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 14 (11) :1912-1920
[22]   Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection [J].
Tao Wang ;
Xu Chen ;
Guo-Quan Lu ;
Guang-Yin Lei .
Journal of Electronic Materials, 2007, 36 :1333-1340
[23]   Low-temperature sintering with nano-silver paste in die-attached interconnection [J].
Wang, Tao ;
Chen, Xu ;
Lu, Guo-Quan ;
Lei, Guang-Yin .
JOURNAL OF ELECTRONIC MATERIALS, 2007, 36 (10) :1333-1340
[24]   Determining the Constitutive Properties of Sintered Nano Silver via Reverse Analysis and Nanoindentation [J].
Niu, Xiaoyan ;
Wei, Shaoteng ;
Dong, Guoqiang ;
Geng, Xuchen ;
Zhang, Xinchun ;
Zhou, Jiang .
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2023, 32 (16) :7418-7427
[25]   Determining the Constitutive Properties of Sintered Nano Silver via Reverse Analysis and Nanoindentation [J].
Xiaoyan Niu ;
Shaoteng Wei ;
Guoqiang Dong ;
Xuchen Geng ;
Xinchun Zhang ;
Jiang Zhou .
Journal of Materials Engineering and Performance, 2023, 32 :7418-7427
[26]   Cu-Cu joining using citrate coated ultra-small nano-silver pastes [J].
Zhang, Shuye ;
Wang, Qian ;
Lin, Tiesong ;
Zhang, Pengzhe ;
He, Peng ;
Paik, Kyung-Wook .
JOURNAL OF MANUFACTURING PROCESSES, 2021, 62 :546-554
[27]   The mechanism of pore segregation in the sintered nano Ag for high temperature power electronics applications [J].
Zhao, Zhenyu ;
Zou, Guisheng ;
Zhang, Hongqiang ;
Ren, Hui ;
Liu, Lei ;
Zhou, Y. Norman .
MATERIALS LETTERS, 2018, 228 :168-171
[28]   Enhanced adhesion strength of silver paste on AlN ceramic substrate via sintered nano-CuO [J].
Zou, Yanqing ;
Fu, Renli ;
Liu, Xuhai ;
Liu, Houbao ;
Wang, He .
CERAMICS INTERNATIONAL, 2021, 47 (07) :9471-9476
[29]   Failure mechanism of composite laminates with different size multiple delaminations subjected to compressive load [J].
Suemasu, H ;
Wakabayashi, H .
COLLECTION OF THE 41ST AIAA/ASME/ASCE/AHS/ASC STRUCTURES, STRUCTURAL DYNAMICS, AND MATERIALS CONFERENCE AND EXHIBIT, VOL 1 PTS 1-3, 2000, :529-538
[30]   Porous structure and compressive failure mechanism of additively manufactured cubic-lattice tantalum scaffolds [J].
Gao, Hairui ;
Jin, Xia ;
Yang, Jingzhou ;
Zhang, Dachen ;
Zhang, Shupei ;
Zhang, Faqiang ;
Chen, Haishen .
MATERIALS TODAY ADVANCES, 2021, 12