Infrared heating in the technology of soldering components in electronics

被引：0

作者：

V. L. Lanin

机构：

[1] State University of Informatics and Radioelectronics of Belarus,

来源：

Surface Engineering and Applied Electrochemistry | 2007年 / 43卷 / 5期

关键词：

Solder Joint; Emissivity Factor; Print Circuit Board; Apply Electrochemistry; Surface Engineer;

D O I：

10.3103/S1068375507050134

中图分类号：

学科分类号：

摘要：

Parameters of infrared heating for soldering electronic components using surface mounting are investigated and optimized. The main advantages of IR heating are as follows: high rate, low lag effect, possibility to effectively change the temperature and time profile of heating, and the relative simplicity of the equipment.

引用

页码：381 / 386

页数：5